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Champs de vitesse et de température pour aliphatique. Cavité de dimensions (100 mm*100 mm*5 mm) et ΔT = 1 K.
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![Figure 1: Schéma de la configuration considérée [9].](profile/Abderazak-Bennia/publication/338221681/figure/fig1/AS:841409573691393@1577619083828/Schema-de-la-configuration-consideree-9_Q320.jpg)
Dans ce travail, nous présentons une étude numérique de la convection naturelle dans une enceinte rectangulaire verticale sans ou avec chicane. Les équations qui régissent ce phénomène ont été résolues par une approche numérique, basée sur la méthode des volumes finis en utilisant le code Fluent et le mailleur Gambit. Un premier travail de validati...
Citations
In this work, we present a numerical study on the cooling of electronic components using convective fluids. The equations governing this study were solved by a numerical approach, based on the finite volume method using the Ansys-Fluent. A first validation work was carried out by comparing our work with those of other authors. Subsequently, we varied the working fluid in order to find the best convection fluid that allows good cooling of the electronic components.
In recent years, the study of heat transfer on modest heat sources has become a subject of great interest due to advances in the electronics industry. Following recent technological advances in electronics, electronic components are becoming increasingly powerful and increasingly small. Consequently, the heat to be evacuated becomes very important in the electronics field. In fact, nowadays, power components (microprocessors, hard disks, converters, etc.) can dissipate several hundred watts per square centimetre. Overheating components reduces their lifespan and can cause operating constraints. Good heat dissipation is therefore essential to ensure the operation and reliability of these electronics devices. In this work, we conducted a numerical study on the cooling of electronic components. A first validation work was carried out by comparing our results with other works. The main objective of the present study which is "cooling of electronic components" is to find the working fluid which ensures a good evacuation of the heat and consequently a better cooling of the electronic component.
In this work, we presented a thermal numerical study of the power transformer in order to improve the cooling of the latter. The equations that govern this phenomenon will have been solved by a numerical approach, based on the finite volume method using the ANSYS (V19.2). To get the appropriate mesh for our study we tested 3 different meshes. The influence of the latter on the temperature fields and the velocity field will have been considered and the optimal conditions that maximize the heat transfers are determined. The main objective of this first part of our work is to find the optimal mesh that allows us to launch the simulation using the ANSYS software.
In recent years, the study of heat transfer on modest heat sources has become a subject of great interest due to advances in the electronics industry. Following recent technological advances in electronics, electronic components are becoming increasingly powerful and increasingly small. Consequently, the heat to be evacuated becomes very important in the electronics field. In fact, nowadays, power components (microprocessors, hard disks, converters, etc.) can dissipate several hundred watts per square centimetre. Overheating components reduces their lifespan and can cause operating constraints. Good heat dissipation is therefore essential to ensure the operation and reliability of these electronics devices. In this work, we conducted a numerical study on the cooling of electronic components. A first validation work was carried out by comparing our results with other works. The main objective of the present study which is "cooling of electronic components" is to find the working fluid which ensures a good evacuation of the heat and consequently a better cooling of the electronic component.
In this work, we present a numerical study of natural convection in a vertical rectangular cavity simulating a thermosyphon. The equations which govern this phenomenon were solved by a numerical approach, based on the finite volume method using the Fluent code and the Gambit mesh generator. A first validation work was carried out by comparing our work with that of other authors. Subsequently, the working fluid was varied. The influence of these convection fluids on the temperature fields, the heat flux density and the Nusselt number was thus considered and the optimal conditions which maximize the heat transfer determined.
