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![Figure 5 Binary Al-Zn diagram [7]](profile/Igor-Kostolny/publication/308051681/figure/fig1/AS:566575934775296@1512093637556/Binary-Al-Zn-diagram-7_Q320.jpg)
The aim of this work was to evaluate the direct bonding of Al2O3, SiC ceramics and Cu substrates. Joints were fabricated by using 40 kHz frequency ultrasound. The Zn4Al solder wetted all materials studied and joints of good quality were produced. The shear strength attained with Al2O3 ceramics was 81 MPa. The strength with SiC ceramics was slightly...
Contexts in source publication
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... solid solutions (Zn) and (Al) with a limited solubility occur in the binary Al- Zn system (Fig. 5). Owing to limited solubility, the eutecticum and eutectoid mixture of these solid solutions occurred in the ...
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... test specimens and the actual test piece. Three pieces for each type of alloy were used for experimental assessment. The results of tensile strength tests of soldered type Zn-Al alloys are documented in Fig. 9. Generally, Al content slightly increases the strength of Zn-Al solder. By increasing Al content, the strength of Zn-Al solder increases - Fig. 15. The variance in tensile strength between ZnAl1 and ZnAl4 solder is around 35 ...
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... The experiments to determine the shear strength of soldered joints were also extended to other metallic materials such as Al, Ni, Ti and CrNi steel, in order to prove the wider applicability of Zn4Al solder. For a more exact identification fractured surfaces in the boundary of Cu/Zn4Al and eventually Al 2 O 3 /Zn4Al bonds were also identified (Figs. 15, 16). Formation of a typical ductile failure by shear mechanism was documented in Cu/Zn4Al bond (Fig. 15). Fig. 16 shows the fractured surfaces of Al 2 O 3 /Zn4Al bonds. Fracture morphology evidently shows a visible motion of the shearing tool with a ductile ...
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... materials such as Al, Ni, Ti and CrNi steel, in order to prove the wider applicability of Zn4Al solder. For a more exact identification fractured surfaces in the boundary of Cu/Zn4Al and eventually Al 2 O 3 /Zn4Al bonds were also identified (Figs. 15, 16). Formation of a typical ductile failure by shear mechanism was documented in Cu/Zn4Al bond (Fig. 15). Fig. 16 shows the fractured surfaces of Al 2 O 3 /Zn4Al bonds. Fracture morphology evidently shows a visible motion of the shearing tool with a ductile ...
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Citations
... Zn-based solders were common low-temperature solders mainly used to join aluminum, copper, or ceramic [14,15]. Kolenak et al. [16] joined Zn4Al/Al 2 O 3 ceramic joint and Zn4Al/Al joint by ultrasonic assisted brazing process. In the shear test, the shear strength of the Zn4Al/Al 2 O 3 ceramic joint and the Zn4Al/Al joint reached 81 MPa and 174.5 MPa, respectively. ...
Zn5Al filler metal was used to join 2024Al and Al2O3 ceramic with the ultrasonic assisted soldering process in the atmospheric environment. Al2O3 ceramics were dipped by molten Zn5Al alloy (melting temperature: 382 °C) with the time of ultrasonic action for 5– 600 s, respectively. During the ultrasonic assisted soldering process, the ultrasonic was applied for 1 s, the Al2O3 ceramic was subjected to a pressure of 0.2 MPa. To reduce the residual stress, the soldered joint was cooled in the furnace. 2024Al had better metallurgical fusion with Zn5Al filler metal. The grain boundary on the 2024Al was partially dissolved by Zn5Al filler metal. The fan-shaped α-Al eutectic phases were distributed on the gradient layer. With the increase of the ultrasonic dipping time, more fine β-ZnAl phases were accumulated on the Al2O3 ceramic surface. The Al2O3/Zn5Al/2024Al joint with ultrasonic dipping time of 600 s had the highest shear strength (39.53 MPa). The soldered joint fractured mainly in cohesive failure mode, and the joint broke from the Zn5Al filler metal.
Reliable metallurgical bonding between Al2O3 ceramic and copper was achieved by vacuum brazing using Ag–23Cu–14.5In–3.3Ti (wt.%) alloy. The representative interfacial structure of the joint was Al2O3/Ti3(Cu,Al)3O + γ‐TiO/Ag‐based solid solution + (Cu,Ag)7In3 + Ag–Cu eutectic + Cu‐based solid solution/copper. The interface microstructure evolved with process parameters, including the formation of γ‐TiO and Ti3(Cu,Al)3O, as evidenced by microstructural analysis and etched surface morphology. The relationship between fracture path and shear strength was established by observing the fracture morphology and performing shear strength tests on joints with various process parameters, utilizing the degree of the Ag‐based solid solution loss and the thickness of the reaction layer as evaluative factors. When brazed at 760 or 780°C for 20 min using a 100 µm brazing alloy foil, the brazed joints demonstrated a peak shear strength of 215 ± 25 MPa, and the fracture predominantly occurred in the Al2O3 matrix and Ti3(Cu,Al)3O layer.
In this work, porous Si3N4 ceramics are directly brazed in air using ZnAl filler with the assistance of ultrasonic vibration. The results show that good wetting of ceramic is realized within 10 s at low temperature of 450 °C. Under ultrasonic, high pressure of 7.5 MPa occurs near the entrance of ceramic micro-hole, which helps to overcome the energy barrier (1.09–2.18 MPa) to initiate sonocapillary. The capillary action of the filler is rapid, and then the infiltrated filler tightly bonds with the ceramic. The microstructure analysis reveals that Al element of the filler and O element that pre-dissolved in the filler are the main wetting elements, and the bonding interface is amorphous. It is the high temperature (1500 K) and pressure (4.87 × 10⁸ MPa) caused by the collapse of the cavitation bubbles that cause the rapid wetting of the ceramics, which is proved by simulation. Ultrasonic power higher than Mode II produces joint stronger than the ceramic substrate, showing the potential of ultrasonic brazing.
Nowadays, due to the search for more efficient and steady processes of aluminum combination and the products that cannot be manufactured using flux, the issue of application of flux-free soldering methods for aluminum-based alloys is highly relevant. The lack of the description of the processes and mechanisms of flux-free soldering by the technique of friction of the solder on the aluminum surface makes it urgent to study and describe them in detail. To carry out the study, the authors produced zinc-based alloys and prepared solder rods using the hot pressing method. Using the technique of friction of a rod against the surface of the heated aluminum substrate, the authors identified minimum temperatures of the setting of zinc solders of different compositions with aluminum surfaces. The experiment proves that these temperatures correlate with the liquidus temperatures of these alloys and have similar values. The dependence of minimum setting temperatures on the Al and Cu content in the solder was obtained. The authors studied the influence of the state of the base metal surface on the spreading area of the Zn-4%Al zinc solder during friction application. The experiments determined the zones of solder spreading over the surface of the AD31 aluminum alloy substrate, depending on the roughness of the base metal surface. The study identified that minimum setting temperatures of solders have similar values against the liquidus temperatures of these alloys, and the adding of copper to a solder reduces these temperatures, on average, by 20° С per each percent of added copper. The flowing of Zn–4%Al solder over the AD31 aluminum alloy surface reaches the largest values when treating the surface with rough-grain abrasive cloths, and the flowing effect decreases with the decrease in roughness.
