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Bi-facial process: grow InGaAs cell, flip wafer in reactor load lock, grow rest of cell. InGaAs illuminated through wafer.

Bi-facial process: grow InGaAs cell, flip wafer in reactor load lock, grow rest of cell. InGaAs illuminated through wafer.

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Spire Semiconductor has demonstrated a new bi-facial epigrowth manufacturing process for InGaP/GaAs/InGaAs N/P tandem concentrator cells. NREL has verified 1cm<sup>2</sup> cells as 41.0% efficient at 500X, and 5.5mm cells as 41.4% at 334X, AM1.5D, 25C, matching within measurement error the world record efficiency. A lattice-mismatched 0.94eV InGaAs...

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... Ga 0.83 As/Ge metamorphic cells with 1.1% mismatch were made with efficiency up to 41.1% at 454X by Fraunhofer [3]. Another approach to achieve higher efficiency is to substitute lattice-mismatched InGaAs for the Ge bottom cell (a "Ge-free" approach). The inverted metamorphic (IMM) process ( Fig. 2 Spire Semiconductor's bifacial epigrowth process (Fig. 3) makes InGaP/GaAs/InGaAs tandems without using whole- area wafer bonding and epitaxial liftoff steps which are not standard III-V cell process steps and may be low yield. The dislocations of the lattice mismatched cell are isolated from affecting the middle and top cells on the opposite wafer side by the thick GaAs wafer. Also, no ...

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Citations

... Higher efficiencies can be obtained by optimizing the bandgaps of all three subcells, in which the Ge bottom junction could be replaced with a 1.0 eV junction In 0.3 Ga 0.7 As-based subcell. In a typical 3J cell architecture, the InGaP/GaAs/InGaAs structure is epitaxially grown by molecular beam epitaxy (MBE) or MOCVD methods in an inverted order: on a GaAs substrate, lattice-matched top InGaP and bottom GaAs subcells are grown at first, followed by transparent graded-composition buffer layers, and finally a metamorphic 1 eV InGaAs bottom cell [39,40]. The GaAs substrate is subsequently removed via mechanical polishing and/or chemical wet etching and the thin-film device is bonded to a carrier substrate for the remaining processing steps. ...
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