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The recent popularity of 3D IC technology stems from its enhanced performance capabilities and reduced wiring length. However, the problem of thermal dissipation is magnified due to the nature of these layered technologies. In this paper, we develop techniques to reduce both the local and global congestions of 3D circuit designs in order to allevia...
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... is standard with all annealing algorithms, improvements are guaranteed only at a significant runtime expense. In order to make the procedure as efficient as possible, it becomes necessary to perform highly optimized incremental evaluation, which is described in detail below. Recall the global congestion metric: Given a boundary <B i , B j > between neighboring blocks B i and B j , we defined the boundary congestion to be the number of hyperedges crossing that boundary, denoted by |H ij |. Consider such a hyperedge h in H ij . Let its bounding box lie between (x min , y min , z min ) and (x max , y max , z max ), as shown in Figure 5 ...
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